Ultra-thin chip technology and applications / ed. by J.N.Burghartz. - New York: Springer, 2011. - xxii, 467 p.: ill. - Incl. bibl. ref. - Ind.: p.455-467. - ISBN 978-1-4419-7275-0  Место хранения:   026 | Институт физики полупроводников СО РАН | Новосибирск | Библиотека

Оглавление / Contents

Part I From Thick Wafers to Ultra-Thin Silicon Chips 1 Why Are Silicon Wafers as Thick as They Are? ................ 3 Peter Stallhofer 2 Thin Chips on the ITRS Roadmap ............................. 13 Joachim N. Burghartz Part II Thin Chip Fabrication Technologies 3 Thin Wafer Manufacturing and Handling Using Low Cost Carriers .................................... 21 Florian Schmitt and Michael Zernack 4 Ultra-thin Wafer Fabrication Through Dicing-by-Thinning .... 33 Christof Landesberger, Sabine Scherbaum, and Karlheinz Bock 5 Thin Wafer Handling and Processing without Carrier Substrates ......................................... 45 Yoshikazu Kobayashi, Martin Plankensteiner, and Midoriko Honda 6 Epitaxial Growth and Selective Etching Techniques .......... 53 Evangelos A. Angelopoulos and Alexander Kaiser 7 Silicon-on-Insulator (SOI) Wafer-Based Thin-Chip Fabrication ................................................ 61 Joachim N. Burghartz 8 Fabrication of Ultra-thin Chips Using Silicon Wafers with Buried Cavities ....................................... 69 Martin Zimmermann, Joachim N. Burghartz, Wolfgang Appel, and Christine Harendt Part III Add-on Processing 9 Through-Silicon Vias Using Bosch DRIE Process Technology ... 81 Franz Laermer and Andrea Urban 10 Through-Silicon via Technology for 3D 1С ................... 93 Eric Beyne 11 3D-IC Technology Using Ultra-Thin Chips ................... 109 Mitsumasa Koyanagi 12 Substrate Handling Techniques for Thin Wafer Processing ... 125 Christof Landesberger, Sabine Scherbaum, and Karlheinz Bock Part IV Assembly and Embedding of Ultra-Thin Chips 13 System-in-Foil Technology ................................. 141 Andreas Dietzel, Jeroen van den Brand, Jan Vanfleteren, Wim Christiaens, Erwin Bosman, and Johan De Baets 14 Chip Embedding in Laminates ............................... 159 Andreas Kugler, Metin Koyuncu, Andre Zimmermann, and Jan Kostelnik 15 Handling of Thin Dies with Emphasis on Chip-to-Wafer Bonding ................................................... 167 Fabian Schnegg, Hannes Kostner, Gemot Bock, and Stefan Engensteiner 16 Micro Bump Assembly ....................................... 185 Paresh Limaye and Wenqi Zhang Part V Characterization and Modelling 17 Mechanical Characterisation and Modelling of Thin Chips ... 195 Stephan Schoenfelder, Joerg Bagdahn, and Mattias Petzold 18 Structure Impaired Mechanical Stability of Ultra-thin Chips ..................................................... 219 Tu Hoang, Stefan Endler, and Christine Harendt 19 Piezoresistive Effect in MOSFETS .......................... 233 Nicoleta Wacker and Harald Richter 20 Electrical Device Characterisation on Ultra-thin Chips .... 245 Mahadi-UI Hassan, Horst Rempp, Harald Richter, and Nicoleta Wacker 21 MOS Compact Modelling for Flexible Electronics ............ 259 Slobodan Mijalković 22 Piezojunction Effect: Stress Influence on Bipolar Transistors ............................................... 271 J. Fredrik Creemer and Patrick J. French 23 Thermal Effects in Thin Silicon Dies: Simulation and Modelling ................................................. 287 Niccolò Rinaldi, Salvatore Russo, and Vincenzo d'Alessandro 24 Optical Characterisation of Thin Silicon .................. 309 Michael Reuter and Sebastian J. Eisele Part VI Applications 25 Thin Chips for Power Applications ......................... 321 Kurt Aigner, Oliver Haberlen, Herbert Hopfgartner, and Thomas Laska 26 Thinned Backside-Illuminated (BSI) Imagers ................ 337 Koen De Munck, Kyriaki Minoglou, and Piet De Moor 27 Thin Solar Cells .......................................... 353 Michael Reuter 28 Bendable Electronics for Retinal Implants ................. 363 Heinz-Gerd Graf 29 Thin Chip Flow Sensors for Nonplanar Assembly ............. 377 Hannes Sturm and Walter Lang 30 RFID Transponders ......................................... 389 Cor Scherjon 31 Thin Chips for Document Security .......................... 399 Thomas Suwald 32 Flexible Display Driver Chips ............................. 413 Ali Asif and Harald Richter 33 Microwave Passive Components in Thin Film Technology ...... 425 Behzad Rejaei 34 Through-Silicon via Technology for RF and Millimetre-Wave Applications .............................................. 445 Alvin Joseph, Cheun-Wen Huang, Anthony Stamper, Wayne Woods, Dan Vanslette, Mete Erturk, Jim Dunn, Mike McPartlin, and Mark Doherty Index ........................................................ 455